RC48F3300J0Z00S
vs
PC28F256J3D95B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
INTEL CORP
MICRON TECHNOLOGY INC
Part Package Code
BGA
Package Description
ESBGA-64
BGA, BGA64,8X8,40
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
95 ns
Alternate Memory Width
8
8
Command User Interface
YES
YES
Common Flash Interface
YES
YES
Data Polling
NO
NO
JESD-30 Code
R-PBGA-B64
S-PBGA-B64
Length
13 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
Number of Sectors/Size
256
256
Number of Terminals
64
64
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
BGA
Package Equivalence Code
BGA64,8X8,40
BGA64,8X8,40
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY
Page Size
4/8 words
4/8 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
260
Programming Voltage
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
Sector Size
128K
128K
Standby Current-Max
0.00012 A
0.00012 A
Supply Current-Max
0.08 mA
0.08 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Toggle Bit
NO
NO
Type
NOR TYPE
NOR TYPE
Width
10 mm
Base Number Matches
2
2
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