RC48F3300J0Z00S vs PC28F256J3D95B feature comparison

RC48F3300J0Z00S Intel Corporation

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PC28F256J3D95B Micron Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEL CORP MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description ESBGA-64 BGA, BGA64,8X8,40
Pin Count 64
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 95 ns
Alternate Memory Width 8 8
Command User Interface YES YES
Common Flash Interface YES YES
Data Polling NO NO
JESD-30 Code R-PBGA-B64 S-PBGA-B64
Length 13 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1
Number of Sectors/Size 256 256
Number of Terminals 64 64
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA BGA
Package Equivalence Code BGA64,8X8,40 BGA64,8X8,40
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY
Page Size 4/8 words 4/8 words
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240 260
Programming Voltage 2.7 V
Qualification Status Not Qualified Not Qualified
Ready/Busy YES YES
Seated Height-Max 1.2 mm
Sector Size 128K 128K
Standby Current-Max 0.00012 A 0.00012 A
Supply Current-Max 0.08 mA 0.08 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Toggle Bit NO NO
Type NOR TYPE NOR TYPE
Width 10 mm
Base Number Matches 2 2

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