RC3216J303GS
vs
CR-06JHF
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
|
| Ihs Manufacturer |
SAMSUNG SEMICONDUCTOR INC
|
|
| Package Description |
SMT, 1206
|
|
| Reach Compliance Code |
compliant
|
|
| ECCN Code |
EAR99
|
|
| Construction |
Chip
|
|
| JESD-609 Code |
e3
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
155 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Height |
0.55 mm
|
|
| Package Length |
3.2 mm
|
|
| Package Style |
SMT
|
|
| Package Width |
1.6 mm
|
|
| Packing Method |
Bulk
|
|
| Rated Power Dissipation (P) |
0.25 W
|
|
| Resistance |
30000 Ω
|
|
| Resistor Type |
FIXED RESISTOR
|
|
| Size Code |
1206
|
|
| Technology |
METAL GLAZE/THICK FILM
|
|
| Temperature Coefficient |
100 ppm/°C
|
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
|
| Tolerance |
5%
|
|
| Working Voltage |
200 V
|
|
| Base Number Matches |
2
|
|
|
|
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