RC28F160C3BA90
vs
S29AL016M90FFI022
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
SPANSION INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TBGA, BGA64,8X8,40
|
13 X 11 MM, LEAD FREE, FBGA-64
|
| Pin Count |
64
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Intel
|
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
USER-SELECTABLE 3V OR 12V VPP; BOTTOM BOOT BLOCK
|
BOTTOM BOOT BLOCK
|
| Boot Block |
BOTTOM
|
BOTTOM
|
| Command User Interface |
YES
|
YES
|
| Common Flash Interface |
YES
|
YES
|
| Data Polling |
NO
|
YES
|
| JESD-30 Code |
R-PBGA-B64
|
R-PBGA-B64
|
| JESD-609 Code |
e0
|
e1
|
| Length |
13 mm
|
13 mm
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Sectors/Size |
8,31
|
1,2,1,31
|
| Number of Terminals |
64
|
64
|
| Number of Words |
1048576 words
|
1048576 words
|
| Number of Words Code |
1000000
|
1000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1MX16
|
1MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TBGA
|
LBGA
|
| Package Equivalence Code |
BGA64,8X8,40
|
BGA64,8X8,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.4 mm
|
| Sector Size |
4K,32K
|
16K,8K,32K,64K
|
| Standby Current-Max |
0.000005 A
|
0.000005 A
|
| Supply Current-Max |
0.055 mA
|
0.06 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Toggle Bit |
NO
|
YES
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
10 mm
|
11 mm
|
| Base Number Matches |
1
|
1
|
| Alternate Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare RC28F160C3BA90 with alternatives
Compare S29AL016M90FFI022 with alternatives