RC10K1102FBG vs MCR50JRTF1102 feature comparison

RC10K1102FBG Fenghua (HK) Electronics Ltd

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MCR50JRTF1102 ROHM Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY ROHM CO LTD
Package Description CHIP, ROHS COMPLIANT CHIP
Reach Compliance Code unknown compliant
Construction RECTANGULAR PACKAGE Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method Bulk TR, EMBOSSED, 7 INCH
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C 70 °C
Resistance 11000 Ω 11000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Reference Standard TS 16949

Compare RC10K1102FBG with alternatives

Compare MCR50JRTF1102 with alternatives