RC10K1102FBG vs 2010W2F1102B5E feature comparison

RC10K1102FBG Fenghua (HK) Electronics Ltd

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2010W2F1102B5E Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer FENGHUA ADVANCED TECHNOLOGY ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP, ROHS COMPLIANT
Reach Compliance Code unknown compliant
Construction RECTANGULAR PACKAGE Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.5 mm 2.5 mm
Packing Method Bulk
Rated Power Dissipation (P) 0.5 W 0.5 W
Rated Temperature 70 °C
Resistance 11000 Ω 11000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
Series 2010(1/2W,F TOL)

Compare RC10K1102FBG with alternatives

Compare 2010W2F1102B5E with alternatives