RB080L-30TE25
vs
PMEG3050BEP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
ROHM CO LTD
|
NXP SEMICONDUCTORS
|
| Package Description |
R-PDSO-C2
|
PLASTIC PACKAGE-2
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
8541.10.00.50
|
| Factory Lead Time |
17 Weeks
|
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
NXP
|
| Additional Feature |
HIGH RELIABILITY
|
|
| Application |
GENERAL PURPOSE
|
EFFICIENCY
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
0.51 V
|
|
| JESD-30 Code |
R-PDSO-C2
|
R-PDSO-F2
|
| Moisture Sensitivity Level |
1
|
1
|
| Non-rep Pk Forward Current-Max |
70 A
|
70 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
5 A
|
5 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Rep Pk Reverse Voltage-Max |
30 V
|
|
| Reverse Current-Max |
150 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
SCHOTTKY
|
SCHOTTKY
|
| Terminal Form |
C BEND
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
2
|
| Pin Count |
|
2
|
| Power Dissipation-Max |
|
1.05 W
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
Pure Tin (Sn)
|
|
|
|
Compare RB080L-30TE25 with alternatives