RAC40-8M-10K5%
vs
CND2A10YTTE103J
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
STACKPOLE ELECTRONICS INC
KOA SPEER ELECTRONICS INC
Package Description
CHIP
CHIP, ROHS COMPLIANT
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
8533.21.00.20
Construction
Thick Film
Chip
Element Power Dissipation
0.063 W
0.063 W
First Element Resistance
10000 Ω
10000 Ω
Manufacturer Series
RAC
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Network Type
BUSSED
BUSSED
Number of Elements
8
8
Number of Functions
1
1
Number of Terminals
8
10
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
4 mm
4 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.1 mm
2.1 mm
Packing Method
TR, EMBOSSED, 7 INCH
TR, EMBOSSED PLASTIC, 7 INCH
Rated Power Dissipation (P)
0.063 W
0.063 W
Rated Temperature
70 °C
70 °C
Resistance
10000 Ω
10000 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Series
RAC40-8M
Size Code
0816
0816
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Pbfree Code
Yes
Samacsys Manufacturer
KOA Speer
JESD-609 Code
e3
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Compare RAC40-8M-10K5% with alternatives
Compare CND2A10YTTE103J with alternatives