R80C186XL25
vs
TS68C000MWB/C8
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
THOMSON-CSF SEMICONDUCTORS
|
Part Package Code |
LCC
|
QFN
|
Package Description |
CERAMIC, LCC-68
|
,
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.A.2
|
3A001.A.2.C
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
|
|
Address Bus Width |
20
|
24
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
50 MHz
|
8 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CQCC-N68
|
S-CQCC-J68
|
Length |
24.13 mm
|
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
2
|
|
Number of External Interrupts |
5
|
|
Number of Serial I/Os |
|
|
Number of Terminals |
68
|
68
|
On Chip Data RAM Width |
|
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
|
Package Equivalence Code |
LCC68,.95SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
0
|
|
Seated Height-Max |
3.68 mm
|
|
Speed |
25 MHz
|
8 MHz
|
Supply Current-Max |
100 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Form |
NO LEAD
|
J BEND
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24.13 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
2
|
3
|
Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare R80C186XL25 with alternatives
Compare TS68C000MWB/C8 with alternatives