TS68C000MWB/C8
vs
R80C186-16
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
INTEL CORP
|
Part Package Code |
QFN
|
LCC
|
Package Description |
,
|
CERAMIC, LCC-68
|
Pin Count |
68
|
68
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
20
|
Bit Size |
16
|
16
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
8 MHz
|
32 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-CQCC-J68
|
S-CQCC-N68
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Speed |
8 MHz
|
16 MHz
|
Supply Voltage-Max |
5.5 V
|
5.25 V
|
Supply Voltage-Min |
4.5 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Position |
QUAD
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
3
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Length |
|
24.13 mm
|
Low Power Mode |
|
YES
|
Number of DMA Channels |
|
2
|
Number of External Interrupts |
|
5
|
Number of Serial I/Os |
|
1
|
On Chip Data RAM Width |
|
|
Package Code |
|
QCCN
|
Package Equivalence Code |
|
LCC68A,.95SQ
|
RAM (words) |
|
0
|
Seated Height-Max |
|
3.68 mm
|
Supply Current-Max |
|
150 mA
|
Terminal Finish |
|
TIN LEAD
|
Terminal Pitch |
|
1.27 mm
|
Width |
|
24.13 mm
|
|
|
|
Compare TS68C000MWB/C8 with alternatives
Compare R80C186-16 with alternatives