R1LV1616HBG-5SI#B0
vs
CY62167DV30L-55BVI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
CYPRESS SEMICONDUCTOR CORP
Part Package Code
FBGA(48)
BGA
Package Description
BGA,
VFBGA, BGA48,6X8,30
Pin Count
48
48
Manufacturer Package Code
PTBG0048HF
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Factory Lead Time
52 Weeks
Samacsys Manufacturer
Renesas Electronics
Access Time-Max
55 ns
55 ns
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Memory Density
16777216 bit
16777216 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.2 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Base Number Matches
1
2
I/O Type
COMMON
Length
9.5 mm
Output Characteristics
3-STATE
Package Equivalence Code
BGA48,6X8,30
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
1 mm
Standby Current-Max
0.000015 A
Standby Voltage-Min
1.5 V
Supply Current-Max
0.03 mA
Terminal Pitch
0.75 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
8 mm
Compare R1LV1616HBG-5SI#B0 with alternatives
Compare CY62167DV30L-55BVI with alternatives