Part Details for CY62167DV30L-55BVI by Cypress Semiconductor
Overview of CY62167DV30L-55BVI by Cypress Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for CY62167DV30L-55BVI
CY62167DV30L-55BVI CAD Models
CY62167DV30L-55BVI Part Data Attributes
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CY62167DV30L-55BVI
Cypress Semiconductor
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Datasheet
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CY62167DV30L-55BVI
Cypress Semiconductor
Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 9.50 MM, 1 MM HEIGHT, VFBGA-48
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | VFBGA, BGA48,6X8,30 | |
| Pin Count | 48 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e0 | |
| Length | 9.5 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA48,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1 mm | |
| Standby Current-Max | 0.000015 A | |
| Standby Voltage-Min | 1.5 V | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.2 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 8 mm |
Alternate Parts for CY62167DV30L-55BVI
This table gives cross-reference parts and alternative options found for CY62167DV30L-55BVI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY62167DV30L-55BVI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| BH616UV1611AIG55 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, GREEN, BGA-48 | Brilliance Semiconductor Inc | CY62167DV30L-55BVI vs BH616UV1611AIG55 |
| BH616UV1611AIP55 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 6 X 8 MM, 0.75 MM PITCH, ROHS COMPLIANT, BGA-48 | Brilliance Semiconductor Inc | CY62167DV30L-55BVI vs BH616UV1611AIP55 |
| K6F1616U6A-EF550 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 7.50 X 9.50 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | CY62167DV30L-55BVI vs K6F1616U6A-EF550 |
| CY62167DV30LL-55BVXIT | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 8 X 9.50 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-48 | Infineon Technologies AG | CY62167DV30L-55BVI vs CY62167DV30LL-55BVXIT |
| K6F1616U6B-EF550 | Cache SRAM, 1MX16, 55ns, CMOS, PBGA48, 7 X 7 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | CY62167DV30L-55BVI vs K6F1616U6B-EF550 |
| HM62V16100LBPI-5SL | 1MX16 STANDARD SRAM, 55ns, PBGA48, 0.75 MM PITCH, CSP-48 | Renesas Electronics Corporation | CY62167DV30L-55BVI vs HM62V16100LBPI-5SL |
| R1LV1616HBG-5SI#B0 | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit), FBGA(48), /Tray | Renesas Electronics Corporation | CY62167DV30L-55BVI vs R1LV1616HBG-5SI#B0 |
| K6F1616U6C-XF550 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48 | Samsung Semiconductor | CY62167DV30L-55BVI vs K6F1616U6C-XF550 |
| K6F1616T6B-EF550 | Standard SRAM, 1MX16, 55ns, CMOS, PBGA48, 7 X 7 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | CY62167DV30L-55BVI vs K6F1616T6B-EF550 |
| R1LV1616RBG-5SR | 1MX16 STANDARD SRAM, 55ns, PBGA48, 7.50 X 8.50 MM, 0.75 MM PITCH, FBGA-48 | Renesas Electronics Corporation | CY62167DV30L-55BVI vs R1LV1616RBG-5SR |