R1LP0408CSP-7LC vs P4C1256L-70DC feature comparison

R1LP0408CSP-7LC Renesas Electronics Corporation

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P4C1256L-70DC Pyramid Semiconductor Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer RENESAS TECHNOLOGY CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code SOIC DIP
Package Description 0.525 INCH, PLASTIC, SOP-32 0.300 INCH, CERAMIC, DIP-28
Pin Count 32 28
Reach Compliance Code unknown unknown
Access Time-Max 70 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-CDIP-T28
Length 20.75 mm 37.719 mm
Memory Density 4194304 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 8 8
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Terminals 32 28
Number of Words 524288 words 32768 words
Number of Words Code 512000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Organization 512KX8 32KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code SOP DIP
Package Equivalence Code SOP32,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Power Supplies 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.05 mm 5.715 mm
Standby Current-Max 0.00001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Width 11.4 mm 7.62 mm
Base Number Matches 2 4
Additional Feature LG-MAX
JESD-609 Code e0
Terminal Finish TIN LEAD

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