R1LP0408CSP-7LC
vs
EDI88512LPA20F32B
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
MICROSEMI CORP
|
| Part Package Code |
SOIC
|
DFP
|
| Package Description |
0.525 INCH, PLASTIC, SOP-32
|
CERAMIC, DFP-32
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
70 ns
|
20 ns
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDSO-G32
|
R-CDFP-F32
|
| Length |
20.75 mm
|
21.2852 mm
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of Words |
524288 words
|
524288 words
|
| Number of Words Code |
512000
|
512000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Organization |
512KX8
|
512KX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP32,.56
|
FL32,.4
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.05 mm
|
2.8448 mm
|
| Standby Current-Max |
0.00001 A
|
0.002 A
|
| Standby Voltage-Min |
2 V
|
2 V
|
| Supply Current-Max |
0.025 mA
|
0.225 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
MILITARY
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
| Width |
11.4 mm
|
10.7442 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.32.00.41
|
| Additional Feature |
|
TTL COMPATIBLE INPUTS/OUTPUTS; LG-MAX
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare R1LP0408CSP-7LC with alternatives
Compare EDI88512LPA20F32B with alternatives