QT2025PBKD-1
vs
QT2025PRKDB-1
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
APPLIED MICRO CIRCUITS CORP
|
M/A-COM TECHNOLOGY SOLUTIONS INC
|
Part Package Code |
BGA
|
|
Package Description |
13 X 13 MM, 1 MM PITCH, BGA-144
|
13 X 13 MM, 1 MM PITCH, GREEN, BGA-144
|
Pin Count |
144
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
|
JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
Length |
13 mm
|
13 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
80 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Seated Height-Max |
1.68 mm
|
1.68 mm
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
MANCHESTER ENCODER
|
MANCHESTER ENCODER
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
13 mm
|
13 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
MACOM
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
TIN SILVER COPPER
|
|
|
|
Compare QT2025PBKD-1 with alternatives
Compare QT2025PRKDB-1 with alternatives