QS8888-20D vs IDT7188S30P feature comparison

QS8888-20D Quality Semiconductor Inc

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IDT7188S30P Integrated Device Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer QUALITY SEMICONDUCTOR INC INTEGRATED DEVICE TECHNOLOGY INC
Reach Compliance Code unknown not_compliant
Access Time-Max 19 ns 30 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T22 R-PDIP-T22
JESD-609 Code e0 e0
Memory Density 65536 bit 65536 bit
Memory IC Type CACHE TAG SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 16KX4 16KX4
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP22,.3 DIP22,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.015 A 0.015 A
Standby Voltage-Min 4.5 V 4.5 V
Supply Current-Max 0.12 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 1 1
Pbfree Code No
Part Package Code DIP
Package Description DIP, DIP22,.3
Pin Count 22
ECCN Code EAR99
HTS Code 8542.32.00.41
Length 26.797 mm
Seated Height-Max 4.191 mm
Width 7.62 mm

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