QS3VH257S1G
vs
SN74CB3T3125PWG4
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
SOIC-16
|
TSSOP-14
|
Pin Count |
16
|
14
|
Manufacturer Package Code |
DCG16
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
CB3Q/3VH/3C/2B
|
CB3T/3VT
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G14
|
JESD-609 Code |
e3
|
e4
|
Length |
9.9 mm
|
5 mm
|
Logic IC Type |
BUS EXCHANGER
|
BUS DRIVER
|
Moisture Sensitivity Level |
3
|
1
|
Number of Bits |
4
|
1
|
Number of Functions |
1
|
4
|
Number of Ports |
3
|
2
|
Number of Terminals |
16
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP16,.25
|
TSSOP14,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
0.2 ns
|
0.25 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.7272 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
3.9116 mm
|
4.4 mm
|
Base Number Matches |
3
|
1
|
Samacsys Manufacturer |
|
Texas Instruments
|
Control Type |
|
ENABLE LOW
|
Count Direction |
|
BIDIRECTIONAL
|
Packing Method |
|
TUBE
|
Power Supply Current-Max (ICC) |
|
0.04 mA
|
Prop. Delay@Nom-Sup |
|
0.25 ns
|
Technology |
|
CMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare QS3VH257S1G with alternatives
Compare SN74CB3T3125PWG4 with alternatives