QS316212PV
vs
CBT16212DL,512
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTEGRATED DEVICE TECHNOLOGY INC
NXP SEMICONDUCTORS
Package Description
SSOP, SSOP56,.4
PLASTIC, SSOP-56
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
316212
CBT/FST/QS/5C/B
JESD-30 Code
R-PDSO-G56
R-PDSO-G56
JESD-609 Code
e0
e4
Length
18.415 mm
18.425 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Moisture Sensitivity Level
1
2
Number of Bits
12
12
Number of Functions
2
1
Number of Ports
4
4
Number of Terminals
56
56
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP56,.4
SSOP56,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel)
225
260
Propagation Delay (tpd)
0.25 ns
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.794 mm
2.8 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
30
Width
7.493 mm
7.5 mm
Base Number Matches
2
2
Part Package Code
SSOP
Pin Count
56
Manufacturer Package Code
SOT371-1
Compare QS316212PV with alternatives
Compare CBT16212DL,512 with alternatives
CBT16212DL,512 vs IDTQS316212PV8
CBT16212DL,512 vs CBTD16212DL
CBT16212DL,512 vs FST16212MEAX
CBT16212DL,512 vs CBTD16212DL,112
CBT16212DL,512 vs SN74CBT16212ADLG4
CBT16212DL,512 vs PI5C16212VEX
CBT16212DL,512 vs SN74CBT16212ADL
CBT16212DL,512 vs 74LVX16212MEA
CBT16212DL,512 vs PI5C16212VE