QP7C292A-25DMB
vs
5962-8765001JA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
WAFERSCALE INTEGRATION INC
Part Package Code
DIP
Package Description
DIP,
CERAMIC, DIP-24
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
Memory Density
16384 bit
16384 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
2KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
4
Access Time-Max
50 ns
JESD-609 Code
e0
Supply Current-Max
0.12 mA
Terminal Finish
TIN LEAD
Compare QP7C292A-25DMB with alternatives
Compare 5962-8765001JA with alternatives