QP7C292A-25DMB
vs
M38510/21004BLX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
QP SEMICONDUCTOR INC
PHILIPS COMPONENTS
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-GDIP-T24
R-XDIP-T24
Memory Density
16384 bit
4194304 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2KX8
256KX16
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
5
Access Time-Max
200 ns
Supply Current-Max
0.06 mA
Compare QP7C292A-25DMB with alternatives
Compare M38510/21004BLX with alternatives