QD27C256-200V10
vs
CY27C256-200WMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
INTEL CORP
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
DIP
Package Description
WINDOWED, CERDIP-28
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
JESD-609 Code
e0
e0
Length
37.15 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.72 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
0.055 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
1
1
Compare QD27C256-200V10 with alternatives
Compare CY27C256-200WMB with alternatives