QD2148H-2
vs
HM4-6504S-9
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTERSIL CORP
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
QCCN, LCC18,.3X.35
|
| Pin Count |
18
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
45 ns
|
120 ns
|
| Additional Feature |
AUTOMATIC POWER-DOWN
|
|
| JESD-30 Code |
R-GDIP-T18
|
R-XQCC-N18
|
| Length |
22.86 mm
|
|
| Memory Density |
4096 bit
|
4096 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
4
|
1
|
| Number of Functions |
1
|
|
| Number of Ports |
1
|
|
| Number of Terminals |
18
|
18
|
| Number of Words |
1024 words
|
4096 words
|
| Number of Words Code |
1000
|
4000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1KX4
|
4KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
NMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
2
|
| I/O Type |
|
SEPARATE
|
| Package Equivalence Code |
|
LCC18,.3X.35
|
| Standby Current-Max |
|
0.000015 A
|
| Standby Voltage-Min |
|
2 V
|
| Supply Current-Max |
|
0.031 mA
|
|
|
|
Compare QD2148H-2 with alternatives