PY26325PM
vs
27HC641L-55/J
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
PYRAMID SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, DIP-24
WINDOWED, CERDIP-24
Pin Count
24
24
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
25 ns
55 ns
JESD-30 Code
R-PDIP-T24
R-GDIP-T24
JESD-609 Code
e0
e0
Length
31.877 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
Supply Current-Max
0.14 mA
0.094 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
1
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP24,.6
Standby Current-Max
0.0001 A
Compare PY26325PM with alternatives
Compare 27HC641L-55/J with alternatives