Part Details for PY26325PM by Pyramid Semiconductor Corporation
Overview of PY26325PM by Pyramid Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PY26325PM
PY26325PM CAD Models
PY26325PM Part Data Attributes:
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PY26325PM
Pyramid Semiconductor Corporation
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Datasheet
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PY26325PM
Pyramid Semiconductor Corporation
UVPROM, 8KX8, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | PYRAMID SEMICONDUCTOR CORP | |
| Part Package Code | DIP | |
| Package Description | 0.300 INCH, PLASTIC, DIP-24 | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 25 ns | |
| JESD-30 Code | R-PDIP-T24 | |
| JESD-609 Code | e0 | |
| Length | 31.877 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 8KX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.334 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |
Alternate Parts for PY26325PM
This table gives cross-reference parts and alternative options found for PY26325PM. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PY26325PM, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| WS57C49B-45DMB | UVPROM, 8KX8, 45ns, CMOS, CDIP24, | Waferscale Integration Inc | PY26325PM vs WS57C49B-45DMB |
| TMS27C49-5JL | 8KX8 UVPROM, 55ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 | Texas Instruments | PY26325PM vs TMS27C49-5JL |
| X88C64D | EEPROM, 8KX8, 120ns, Parallel, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24 | Xicor Inc | PY26325PM vs X88C64D |
| CY7C261-35WMB | UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 | Cypress Semiconductor | PY26325PM vs CY7C261-35WMB |
| S63364C-P | MASK ROM, 8KX8, 120ns, CMOS, PDIP24 | Gould Ami | PY26325PM vs S63364C-P |
| H1264B-55Y[PWRDOWN] | MASK ROM, 8KX8, 55ns, CMOS, CDIP24 | Hughes Aircraft | PY26325PM vs H1264B-55Y[PWRDOWN] |
| 27HC641-70/J | 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 | Microchip Technology Inc | PY26325PM vs 27HC641-70/J |
| WS57C49B-45D | UVPROM, 8KX8, 45ns, CMOS, CDIP24, | Waferscale Integration Inc | PY26325PM vs WS57C49B-45D |
| AM27C49-35DC | UVPROM, 8KX8, 35ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 | AMD | PY26325PM vs AM27C49-35DC |
| PY26325WC | UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | Pyramid Semiconductor Corporation | PY26325PM vs PY26325WC |