PX1011B-EL1/G
vs
PX1011A-EL1
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
9 X 9 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, MO-205, SOT643-1, LFBGA-81
|
LFBGA,
|
| Pin Count |
81
|
81
|
| Manufacturer Package Code |
SOT-643-1
|
SOT-643-1
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B81
|
S-PBGA-B81
|
| Length |
9 mm
|
9 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
81
|
81
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.6 mm
|
1.6 mm
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
9 mm
|
9 mm
|
| Base Number Matches |
4
|
6
|
|
|
|
Compare PX1011B-EL1/G with alternatives
Compare PX1011A-EL1 with alternatives