PX1011A-EL1
vs
PX1012A-EL1/G
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
LFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
81
|
| Manufacturer Package Code |
|
SOT-643-1
|
| JESD-30 Code |
|
S-PBGA-B81
|
| JESD-609 Code |
|
e1
|
| Length |
|
9 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
81
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LFBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.6 mm
|
| Supply Voltage-Nom |
|
1.2 V
|
| Surface Mount |
|
YES
|
| Telecom IC Type |
|
INTERFACE CIRCUIT
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
9 mm
|
|
|
|
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