PX1012A-EL1/G
vs
PX1011AI-EL1/G
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
,
LFBGA,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.39.00.01
Base Number Matches
2
2
Rohs Code
Part Package Code
BGA
Pin Count
81
Manufacturer Package Code
SOT-643-1
JESD-30 Code
S-PBGA-B81
JESD-609 Code
e1
Length
9 mm
Number of Functions
1
Number of Terminals
81
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
Package Code
LFBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status
Not Qualified
Seated Height-Max
1.6 mm
Supply Voltage-Nom
1.2 V
Surface Mount
YES
Telecom IC Type
INTERFACE CIRCUIT
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Width
9 mm
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