PTN3310DP,118
vs
PTN3310D,112
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
3 MM, PLASTIC, SOT-505-1, TSSOP-8
|
3.90 MM, PLASTIC, SOT-96-1, SOP-8
|
| Pin Count |
8
|
8
|
| Manufacturer Package Code |
SOT505-1
|
SOT96-1
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Delay-Max |
3 ns
|
3 ns
|
| Interface IC Type |
LVDS TO PECL TRANSLATOR
|
LVDS TO PECL TRANSLATOR
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Latch or Register |
NONE
|
NONE
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Package Equivalence Code |
|
SOP8,.25
|
|
|
|
Compare PTN3310DP,118 with alternatives
Compare PTN3310D,112 with alternatives