PRLL5818
vs
PRLL5818,115
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.80
8541.10.00.80
Samacsys Manufacturer
NXP
NXP
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
0.33 V
0.33 V
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Non-rep Pk Forward Current-Max
25 A
25 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Output Current-Max
1 A
1 A
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Rep Pk Reverse Voltage-Max
30 V
30 V
Surface Mount
YES
YES
Technology
SCHOTTKY
SCHOTTKY
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Base Number Matches
5
1
Part Package Code
MELF
Manufacturer Package Code
SOD87
Compare PRLL5818 with alternatives
Compare PRLL5818,115 with alternatives