PPC7448HX1250NC vs MC7448VS1250NC feature comparison

PPC7448HX1250NC Freescale Semiconductor

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MC7448VS1250NC Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA LGA
Package Description BGA, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360
Pin Count 360 360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 1250 MHz 1250 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 1250 MHz 1250 MHz
Supply Voltage-Max 1.15 V 1.15 V
Supply Voltage-Min 1.05 V 1.05 V
Supply Voltage-Nom 1.1 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code Yes
Additional Feature LOW POWER TAKEN FROM SLEEP MODE
Moisture Sensitivity Level 1
Package Equivalence Code LGA360,19X19,50
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

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Compare MC7448VS1250NC with alternatives