PPC405EXR-NPD333T
vs
MCF5485CZP200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count
388
388
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
666.66 MHz
66.67 MHz
External Data Bus Width
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.55 mm
Speed
333 MHz
200 MHz
Supply Voltage-Max
1.3 V
3.6 V
Supply Voltage-Min
1.2 V
3 V
Supply Voltage-Nom
1.25 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e0
Moisture Sensitivity Level
3
Package Equivalence Code
BGA388,26X26,40
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s)
40
Compare PPC405EXR-NPD333T with alternatives
Compare MCF5485CZP200 with alternatives