MCF5485CZP200
vs
STPCC0110BTC3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Not Recommended
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Package Description
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
PLASTIC, BGA-388
Reach Compliance Code
unknown
not_compliant
ECCN Code
5A002.A.1
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
Samacsys Manufacturer
NXP
Bit Size
32
64
Boundary Scan
YES
NO
Clock Frequency-Max
66.67 MHz
14.3 MHz
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e0
e0
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
388
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.38 mm
Speed
200 MHz
100 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
5
1
Pbfree Code
Part Package Code
BGA
Pin Count
388
Address Bus Width
12
External Data Bus Width
64
Package Equivalence Code
BGA388,26X26,50
Compare MCF5485CZP200 with alternatives
Compare STPCC0110BTC3 with alternatives