PPC405EX-NSD533T
vs
MCF5481CVR166
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
APPLIED MICRO CIRCUITS CORP
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
BGA,
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
Pin Count
388
388
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
666.66 MHz
66.67 MHz
External Data Bus Width
Format
FIXED POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
Length
27 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.65 mm
2.55 mm
Speed
533 MHz
166.66 MHz
Supply Voltage-Max
1.3 V
3.6 V
Supply Voltage-Min
1.2 V
3 V
Supply Voltage-Nom
1.25 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
40
Width
27 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
3
JESD-609 Code
e1
Moisture Sensitivity Level
3
Package Equivalence Code
BGA388,26X26,40
Terminal Finish
TIN SILVER COPPER
Compare PPC405EX-NSD533T with alternatives
Compare MCF5481CVR166 with alternatives