MCF5481CVR166
vs
STPCC0110BTC3
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1 MM PITCH, MS-034AAL-1, PBGA-388
PLASTIC, BGA-388
Pin Count
388
388
Reach Compliance Code
compliant
not_compliant
ECCN Code
5A002
HTS Code
8542.31.00.01
8542.31.00.01
Bit Size
32
64
Boundary Scan
YES
NO
Clock Frequency-Max
66.67 MHz
14.3 MHz
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e1
e0
Length
27 mm
35 mm
Low Power Mode
YES
YES
Moisture Sensitivity Level
3
Number of Terminals
388
388
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,40
BGA388,26X26,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.55 mm
2.38 mm
Speed
166.66 MHz
100 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
Width
27 mm
35 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR
Base Number Matches
3
1
Address Bus Width
12
External Data Bus Width
64
Compare MCF5481CVR166 with alternatives
Compare STPCC0110BTC3 with alternatives