PMBFJ174,215
vs
MQ2N5114
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
TO-236
|
|
Package Description |
PLASTIC, SMD, SOT-23, 3 PIN
|
TO-18, 3 PIN
|
Pin Count |
3
|
|
Manufacturer Package Code |
SOT23
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.21.00.95
|
8541.21.00.95
|
Samacsys Manufacturer |
NXP
|
Microchip
|
Configuration |
SINGLE
|
SINGLE
|
DS Breakdown Voltage-Min |
30 V
|
30 V
|
Drain-source On Resistance-Max |
85 Ω
|
75 Ω
|
FET Technology |
JUNCTION
|
JUNCTION
|
JESD-30 Code |
R-PDSO-G3
|
O-MBCY-W3
|
JESD-609 Code |
e3
|
|
Number of Elements |
1
|
1
|
Number of Terminals |
3
|
3
|
Operating Mode |
DEPLETION MODE
|
DEPLETION MODE
|
Operating Temperature-Max |
150 °C
|
200 °C
|
Package Body Material |
PLASTIC/EPOXY
|
METAL
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
CYLINDRICAL
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
Power Dissipation-Max (Abs) |
0.3 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN
|
|
Terminal Form |
GULL WING
|
WIRE
|
Terminal Position |
DUAL
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Transistor Application |
SWITCHING
|
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
2
|
Factory Lead Time |
|
36 Weeks
|
Additional Feature |
|
HIGH RELIABILITY
|
Feedback Cap-Max (Crss) |
|
7 pF
|
JEDEC-95 Code |
|
TO-206AA
|
Operating Temperature-Min |
|
-65 °C
|
Power Dissipation Ambient-Max |
|
0.5 W
|
Reference Standard |
|
MIL-19500
|
|
|
|
Compare PMBFJ174,215 with alternatives
Compare MQ2N5114 with alternatives