PLB2224
vs
STULPI01BTBR
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
INFINEON TECHNOLOGIES AG
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
PLASTIC, BGA-272
3.6 X 3.6 MM, ROHS COMPLIANT, MICRO TFBGA-36
Pin Count
272
36
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B272
S-PBGA-B36
JESD-609 Code
e0
e2
Length
27 mm
3.6 mm
Number of Functions
1
1
Number of Terminals
272
36
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Equivalence Code
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.35 mm
1.16 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
SUPPORT CIRCUIT
SUPPORT CIRCUIT
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
3.6 mm
Base Number Matches
1
1
ECCN Code
EAR99
Factory Lead Time
32 Weeks, 4 Days
Samacsys Manufacturer
STMicroelectronics
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare PLB2224 with alternatives
Compare STULPI01BTBR with alternatives