STULPI01BTBR
vs
AHA4524A-031PTC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
COMTECH AHA CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
3.6 X 3.6 MM, ROHS COMPLIANT, MICRO TFBGA-36
|
TFQFP, TQFP64,.35SQ,16
|
| Pin Count |
36
|
64
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| JESD-30 Code |
S-PBGA-B36
|
S-PQFP-G64
|
| JESD-609 Code |
e2
|
|
| Length |
3.6 mm
|
7 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
220
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.16 mm
|
1.2 mm
|
| Supply Voltage-Nom |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
SUPPORT CIRCUIT
|
SUPPORT CIRCUIT
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
|
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.6 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
| Package Equivalence Code |
|
TQFP64,.35SQ,16
|
| Supply Current-Max |
|
0.07 mA
|
|
|
|
Compare STULPI01BTBR with alternatives
Compare AHA4524A-031PTC with alternatives