STULPI01BTBR
vs
AHA4524A-031PTC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Contact Manufacturer
Ihs Manufacturer
STMICROELECTRONICS
COMTECH AHA CORP
Part Package Code
BGA
QFP
Package Description
3.6 X 3.6 MM, ROHS COMPLIANT, MICRO TFBGA-36
TFQFP, TQFP64,.35SQ,16
Pin Count
36
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
32 Weeks, 4 Days
Samacsys Manufacturer
STMicroelectronics
JESD-30 Code
S-PBGA-B36
S-PQFP-G64
JESD-609 Code
e2
Length
3.6 mm
7 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
36
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFQFP
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
220
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.16 mm
1.2 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
SUPPORT CIRCUIT
SUPPORT CIRCUIT
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.4 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
3.6 mm
7 mm
Base Number Matches
1
1
Package Equivalence Code
TQFP64,.35SQ,16
Supply Current-Max
0.07 mA
Compare STULPI01BTBR with alternatives
Compare AHA4524A-031PTC with alternatives