PIC32MX230F256DT-50I/TL vs PIC32MX230F256D-50V/PT feature comparison

PIC32MX230F256DT-50I/TL Microchip Technology Inc

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PIC32MX230F256D-50V/PT Microchip Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description VTLA-44 TQFP-44
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Date Of Intro 2016-04-11 2016-04-11
Has ADC YES YES
Additional Feature THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY AEC-Q100 PLANNED, THIS DEVICE FEATURES 3KBYTE OF BOOT FLASH MEMORY
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 50 MHz 40 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-XBCC-N44 S-PQFP-G44
JESD-609 Code e4
Length 6 mm 10 mm
Number of I/O Lines 33 33
Number of Terminals 44 44
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVBCC TQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE FLATPACK, THIN PROFILE
RAM (bytes) 16384 16384
ROM (words) 262144 262144
ROM Programmability FLASH FLASH
Screening Level TS 16949 AEC-Q100; ISO/TS-16949
Seated Height-Max 1 mm 1.2 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.3 V 2.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position BOTTOM QUAD
Width 6 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1
Boundary Scan YES

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