PIC18F26Q83-I/SP
vs
PIC18F26Q84T-I/5N
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
DIP-28
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Factory Lead Time |
6 Weeks
|
6 Weeks
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Has ADC |
YES
|
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Boundary Scan |
YES
|
|
| CPU Family |
PIC18
|
|
| Clock Frequency-Max |
64 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-PDIP-T28
|
|
| Length |
34.671 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
8
|
|
| Number of External Interrupts |
3
|
|
| Number of I/O Lines |
25
|
|
| Number of Serial I/Os |
4
|
|
| Number of Terminals |
28
|
|
| Number of Timers |
8
|
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP28,.3
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| RAM (bytes) |
12800
|
|
| ROM (words) |
65536
|
65536
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
5.08 mm
|
|
| Speed |
64 MHz
|
64 MHz
|
| Supply Current-Max |
13.8 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
3 V
|
1.8 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
|
| Width |
7.62 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare PIC18F26Q83-I/SP with alternatives
Compare PIC18F26Q84T-I/5N with alternatives