PIC17C756AT-33I/L vs PIC17C756-33I/L feature comparison

PIC17C756AT-33I/L Microchip Technology Inc

Buy Now Datasheet

PIC17C756-33I/L Microchip Technology Inc

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Part Package Code LCC LCC
Package Description PLASTIC, MO-047, LCC-68 PLASTIC, LCC-68
Pin Count 68 68
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO NO
Clock Frequency-Max 33 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 16
JESD-30 Code S-PQCC-J68 S-PQCC-J68
JESD-609 Code e3
Length 24.23 mm 24.2316 mm
Moisture Sensitivity Level 3
Number of I/O Lines 50 50
Number of Terminals 68 68
On Chip Program ROM Width 16 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 902 902
ROM (words) 16384 16384
ROM Programmability OTPROM OTPROM
Seated Height-Max 4.57 mm 4.699 mm
Speed 33 MHz 33 MHz
Supply Voltage-Max 5.5 V 6 V
Supply Voltage-Min 5 V 5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 24.23 mm 24.2316 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 2
CPU Family PIC
Package Equivalence Code LDCC68,1.0SQ
Supply Current-Max 50 mA

Compare PIC17C756AT-33I/L with alternatives

Compare PIC17C756-33I/L with alternatives