PIC16LF1824TE/ML
vs
PIC16F1824T-H/MLVAO
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QFN
|
|
Package Description |
HVQCCN,
|
QFN-16
|
Pin Count |
16
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A001.A.2.A
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Additional Feature |
1.8 V MINIMUM SUPPLY AT 16 MHZ
|
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Clock Frequency-Max |
32 MHz
|
32 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
Length |
4 mm
|
4 mm
|
Number of I/O Lines |
12
|
12
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1 mm
|
1 mm
|
Speed |
32 MHz
|
|
Supply Voltage-Max |
3.6 V
|
|
Supply Voltage-Min |
2.5 V
|
|
Supply Voltage-Nom |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4 mm
|
4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
JESD-609 Code |
|
e3
|
On Chip Program ROM Width |
|
8
|
ROM (words) |
|
7168
|
Screening Level |
|
AEC-Q100; TS 16949
|
Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare PIC16LF1824TE/ML with alternatives
Compare PIC16F1824T-H/MLVAO with alternatives