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PI74SSTUA32864NB vs SSTUM32865ET/G,518 feature comparison

PI74SSTUA32864NB Diodes Incorporated

Buy Now Datasheet

SSTUM32865ET/G,518 NXP Semiconductors

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Package Description LFBGA, BGA96,6X16,32 TFBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B160
JESD-609 Code e0
Length 13.5 mm 13 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3 2
Number of Bits 25 28
Number of Functions 1 1
Number of Terminals 96 160
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA96,6X16,32 BGA160,12X18,25
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 2 ns 1.4 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.48 mm 1.15 mm
Supply Voltage-Max (Vsup) 1.9 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 9 mm
fmax-Min 350 MHz 450 MHz
Base Number Matches 1 1
Part Package Code BGA
Pin Count 160
Manufacturer Package Code SOT802-2
Output Characteristics OPEN-DRAIN
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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Compare SSTUM32865ET/G,518 with alternatives