PI74SSTUA32864NB vs SSTU32864EC,518 feature comparison

PI74SSTUA32864NB Diodes Incorporated

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SSTU32864EC,518 NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer DIODES INC NXP SEMICONDUCTORS
Package Description LFBGA, BGA96,6X16,32 LFBGA,
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE
Family SSTU SSTU
JESD-30 Code R-PBGA-B96 R-PBGA-B96
JESD-609 Code e0
Length 13.5 mm 13.5 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Moisture Sensitivity Level 3
Number of Bits 25 25
Number of Functions 1 1
Number of Terminals 96 96
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA96,6X16,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd) 2 ns 2 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.48 mm 1.5 mm
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.5 mm
fmax-Min 350 MHz 450 MHz
Base Number Matches 1 1
Part Package Code BGA
Pin Count 96
Manufacturer Package Code SOT536-1

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Compare SSTU32864EC,518 with alternatives