PI3C34EX245BEX
vs
SN74CBTLV16211GQLR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
DIODES INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
SSOP,
|
VFBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CB3Q/3VH/3C/2B
|
CBTLV/3B
|
| JESD-30 Code |
R-PDSO-G80
|
R-PBGA-B56
|
| JESD-609 Code |
e3
|
|
| Length |
20.5 mm
|
7 mm
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Moisture Sensitivity Level |
2
|
|
| Number of Bits |
8
|
12
|
| Number of Functions |
4
|
2
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
80
|
56
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
VFBGA
|
| Package Equivalence Code |
SSOP80,.25,20
|
BGA56,6X10,25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Propagation Delay (tpd) |
0.25 ns
|
0.25 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
3.9 mm
|
4.5 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
56
|
| Additional Feature |
|
TTL COMPATIBLE BUS SWITCH
|
|
|
|
Compare PI3C34EX245BEX with alternatives
Compare SN74CBTLV16211GQLR with alternatives