PI3B3383L
vs
PI3B4010NE
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
PERICOM SEMICONDUCTOR CORP
|
PERICOM SEMICONDUCTOR CORP
|
| Part Package Code |
TSSOP
|
BGA
|
| Package Description |
TSSOP, TSSOP24,.25
|
TFBGA,
|
| Pin Count |
24
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
CBTLV/3B
|
CBTLV/3B
|
| JESD-30 Code |
R-PDSO-G24
|
S-PBGA-B64
|
| JESD-609 Code |
e0
|
e1
|
| Length |
7.8 mm
|
7 mm
|
| Logic IC Type |
BUS EXCHANGER
|
BUS EXCHANGER
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
4
|
| Number of Ports |
4
|
5
|
| Number of Terminals |
24
|
64
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TFBGA
|
| Package Equivalence Code |
TSSOP24,.25
|
BGA64,11X11,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
3.465 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
3.135 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
4.4 mm
|
7 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare PI3B3383L with alternatives
Compare PI3B4010NE with alternatives