PI3B16233VE
vs
PI3B4010NC
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
PERICOM SEMICONDUCTOR CORP
PERICOM SEMICONDUCTOR CORP
Part Package Code
SSOP
BGA
Package Description
SSOP, SSOP56,.4
TFBGA, BGA64,11X11,20
Pin Count
56
64
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
CBTLV/3B
CBTLV/3B
JESD-30 Code
R-PDSO-G56
S-PBGA-B64
Length
18.415 mm
7 mm
Logic IC Type
BUS EXCHANGER
BUS EXCHANGER
Number of Bits
8
10
Number of Functions
2
4
Number of Ports
3
5
Number of Terminals
56
64
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
TFBGA
Package Equivalence Code
SSOP56,.4
BGA64,11X11,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, SHRINK PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
0.25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.79 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.635 mm
0.5 mm
Terminal Position
DUAL
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.5 mm
7 mm
Base Number Matches
2
2
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare PI3B16233VE with alternatives
Compare PI3B4010NC with alternatives