PF38F5060M0Y0C0
vs
M36P0R9070E0ZACE
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NUMONYX
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA107,9X12,32
8 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-107
Pin Count
107
107
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
96 ns
70 ns
Additional Feature
PSEUDO SRAM IS ORGANIZED AS 8M X 16
PSRAM IS ORGANISED AS 8M X 16BIT
JESD-30 Code
R-PBGA-B107
R-PBGA-B107
JESD-609 Code
e1
Length
11 mm
11 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Mixed Memory Type
FLASH+PSRAM
FLASH+PSRAM
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
107
107
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-30 °C
-30 °C
Organization
32MX16
32MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA107,9X12,32
BGA107,9X12,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Current-Max
0.00016 A
Supply Voltage-Max (Vsup)
2 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
COMMERCIAL EXTENDED
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
3
3
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
40
Compare PF38F5060M0Y0C0 with alternatives
Compare M36P0R9070E0ZACE with alternatives