PE-0603PFB181ST
vs
MMZ1608Y300BTD25
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
PULSE ELECTRONICS CORP
|
TDK CORP
|
| Package Description |
EIA STD PACAKGE SIZE 0603, 2 PIN
|
EIA STD PACKAGE SIZE 1608, SMD, 2 PIN
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Factory Lead Time |
14 Weeks
|
15 Weeks
|
| DC Resistance-Max |
0.09 Ω
|
0.05 Ω
|
| Filter Type |
FERRITE CHIP
|
FERRITE CHIP
|
| Height |
0.8 mm
|
0.8 mm
|
| Insulation Resistance-Min |
1000 MΩ
|
|
| JESD-609 Code |
e3
|
|
| Length |
1.6 mm
|
1.6 mm
|
| Mounting Type |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
105 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Impedance |
180 OHM Ω
|
30 OHM Ω
|
| Package Material |
CERAMIC
|
|
| Packing Method |
TR, 7 INCH
|
TR, 7 INCH
|
| Rated Current |
1.5 A
|
1.5 A
|
| Terminal Finish |
TIN OVER NICKEL
|
|
| Width |
0.8 mm
|
0.8 mm
|
| Base Number Matches |
1
|
1
|
| Samacsys Manufacturer |
|
TDK
|
| Additional Feature |
|
AEC-Q200
|
| Construction |
|
Chip Bead
|
| Screening Level |
|
AEC-Q200
|
|
|
|
Compare PE-0603PFB181ST with alternatives
Compare MMZ1608Y300BTD25 with alternatives