PDTA144TM,315
vs
BCW60FN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SIEMENS A G
|
| Part Package Code |
DFN
|
|
| Package Description |
1 X 0.60 MM, 0.50 MM HEIGHT, LEAD LESS, ULTRA SMALL, PLASTIC, SC-101, 3 PIN
|
SMALL OUTLINE, R-PDSO-G3
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
SOT883
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
4 Weeks
|
|
| Additional Feature |
BUILT-IN BIAS RESISTOR
|
LOW NOISE
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Emitter Voltage-Max |
50 V
|
32 V
|
| Configuration |
SINGLE WITH BUILT-IN RESISTOR
|
SINGLE
|
| DC Current Gain-Min (hFE) |
100
|
100
|
| JESD-30 Code |
R-PBCC-N3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Polarity/Channel Type |
PNP
|
NPN
|
| Power Dissipation-Max (Abs) |
0.25 W
|
0.31 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
3
|
| HTS Code |
|
8541.21.00.75
|
| JEDEC-95 Code |
|
TO-236
|
| Power Dissipation Ambient-Max |
|
0.33 W
|
| Transition Frequency-Nom (fT) |
|
250 MHz
|
| VCEsat-Max |
|
0.55 V
|
|
|
|
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