PDTA115ET,215
vs
PDTA115EK
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
PHILIPS SEMICONDUCTORS
Part Package Code
TO-236
Package Description
PLASTIC PACKAGE-3
,
Pin Count
3
Manufacturer Package Code
SOT23
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
Factory Lead Time
4 Weeks
Additional Feature
BUILT-IN BIAS RESISTOR RATIO IS 1
Collector Current-Max (IC)
0.02 A
0.02 A
Collector-Emitter Voltage-Max
50 V
Configuration
SINGLE WITH BUILT-IN RESISTOR
DC Current Gain-Min (hFE)
80
80
JEDEC-95 Code
TO-236AB
JESD-30 Code
R-PDSO-G3
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
3
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
PNP
PNP
Power Dissipation-Max (Abs)
0.25 W
0.25 W
Qualification Status
Not Qualified
Surface Mount
YES
YES
Terminal Finish
TIN
MATTE TIN
Terminal Form
GULL WING
Terminal Position
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
3
Compare PDTA115ET,215 with alternatives
PDTA115ET,215 vs PDTA115ET
PDTA115ET,215 vs PDTA115EE
PDTA115ET,215 vs PDTA115TT
PDTA115ET,215 vs PDTA115EEF
PDTA115ET,215 vs PDTA115ES
PDTA115ET,215 vs PDTA115TE
PDTA115ET,215 vs PDTA115TE,115
PDTA115ET,215 vs PDTA115EM,315
PDTA115ET,215 vs MUN5141T1G