PDM42225L30GI
vs
LH54V0215HU-25
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
IXYS CORP
|
SHARP CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
15 ns
|
17 ns
|
| Clock Frequency-Max (fCLK) |
33 MHz
|
|
| Cycle Time |
30 ns
|
25 ns
|
| JESD-30 Code |
S-XPGA-P68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
18432 bit
|
9216 bit
|
| Memory IC Type |
OTHER FIFO
|
OTHER FIFO
|
| Memory Width |
18
|
18
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
68
|
| Number of Words |
1024 words
|
512 words
|
| Number of Words Code |
1000
|
512
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1KX18
|
512X18
|
| Output Enable |
YES
|
YES
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
PGA
|
QCCJ
|
| Package Equivalence Code |
PGA68,11X11
|
LDCC68,1.0SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.075 A
|
|
| Supply Current-Max |
0.24 mA
|
0.19 mA
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
PIN/PEG
|
J BEND
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
PERPENDICULAR
|
QUAD
|
| Base Number Matches |
2
|
1
|
| Package Description |
|
0.950 INCH, PLASTIC, LCC-68
|
| Length |
|
24.1808 mm
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Width |
|
24.1808 mm
|
|
|
|
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